Targeting amplifiers, discrete transistors, and diodes where more than 0.5W is consumed, StratEdge's new family of small outline thermally enhanced molded ceramic packages for power semiconductors can be used for silicon, silicon carbide, gallium nitride, and other compound semiconductors in power applications. Able to handle temperatures up to 360°C, the materials used in the packages have matched coefficients of expansion and are assembled using a glass-to-metal seal process combined with gold germanium brazingand can be sealed with metal or ceramic lids that have gold-tin solder preforms. Packages are available in various shapes, sizes, and lead counts and can include gull wing-shaped leads for surface mounting.  From $6.26 each at 10,000 units.