BGA is company product |
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![]() BGA PDF Download |
File Size : | 291680 KB |
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...from vibration and other shipping forces.1. MicroStar BGA Packaging Reference Guide - SSYZ0152. 96 and 114 ball LFBGA Application Note - IDT, Philips Semiconductor and Texas Instruments... ...5. Solder Paste Printing Guidelines for BGA and CSP Assemblies - Donald C. Burr, published in SMTJanuary 1999.6. Maintaining BGA Reliability During Rework - Stuart Downes and Robert Farrell, published in SMT January 1999.... ...Solder Ball CollapseVFBGA Recommended Land Pad DesignA = Via diameter on package = 0.33 mm (for 0.65-mm pitch)B = Land diameter on PCB... |
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