IRG4CF50WB is company product |
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![]() IRG4CF50WB PDF Download |
File Size : | 30346 KB |
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| Description: |
...6" Wafer8/29/01Norminal Backmetal Composition, Thickness: Cr-Ni-Ag ( 1kA-2kA-.2.5kA )Norminal Front Metal Composition, Thickness: 99% Al, 1% Si (4 microns)... ...Wafer Diameter: 150mm, with std. < 100 > flatWafer thickness: .015" + / -.003"Relevant Die Mechanical Dwg. Number 01-5270Minimum Street Width 100 Microns... ...Ink Dot Location Consistent throughout same wafer lotRecommended Storage Environment: Store in original container, in dessicatednitrogen, with no contaminationRecommended Die Attach Conditions For optimum electrical results, die attach... |
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