PDF for TLE2021
TLE2021 is TI [Texas Instruments] company product |
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 TLE2021 PDF Download |
File Size : | 1102.13 KB |
| Manufacturer: | TI [Texas Instruments] | |
| Description: |
...–55°C 100 μV — TLE2021BMFK TLE2021BMJG —to 200 μV TLE2021AMD — TLE2021AMFK TLE2021AMJG TLE2021AMP — —125°C 500 μV TLE2021MD TLE2021MFK TLE2021MJG TLE2021MP?... ...This chip, when properly assembled, display characteristics similar to the TLE2021. Thermal compression orultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted withconductive epoxy or a gold-silicon preform.BONDING PAD ASSIGNMENTS... ... (each input) ±1 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current, IO (each output): TLE2021 ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... |
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| Similar items with "TLE2021" : TLE 4307 DV33, TLE 4307 DV38, TLE 4726 G, TLE-125-01-G-DV , More... | ||
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